| PART |
Description |
Maker |
| 430-10-204-00-240000 430-10-264-00-240000 419-10-2 |
SPRING-LOADED CONNECTORS 2,54 Grid Target Connectors for Spring-Loaded Assemblies Double Row
|
Mill-Max Mfg. Corp.
|
| 4770 4770-0 4770-4 4770-9 4770-2 |
Spring-Loaded Binding Post
|
Pomona Electronics
|
| 15-24-8141 15-24-8145 15-24-8151 15-24-8152 |
SELECTIVELY LOADED RECEPTACLE HEADER ASSY
|
Molex Electronics Ltd.
|
| P70-2200045 |
SMT SPRING LOADED POGO PIN WITH PEG
|
Harwin Plc
|
| 806-22-001-30-013191 |
Spring-Loaded Pin with Removable Pick and Place Cap
|
Mill-Max Mfg. Corp.
|
| 0955016449 95501-6449 |
Modular Jacks, Low Profile, SMT Jack, 4 Positions, 4 loaded
|
Molex Electronics Ltd.
|
| 0901301126 90130-1126 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 3楼矛m (118楼矛) Tin (Sn) over Nickel (Ni)
|
Molex Electronics Ltd.
|
| MM-B2400-R963 0365090025 36509-0025 |
2.54mm (.100) Pitch DIN 41612 Receptacle, Right Angle, Through Hole, with 64 Contacts Loaded, 1.27μm (50μ) Gold (Au) Selective, Lead-Free
2.54mm (.100") Pitch DIN 41612 Receptacle, Right Angle, Through Hole, with 64 Contacts Loaded, 1.27渭m (50渭") Gold (Au) Selective, Lead-Free
|
Molex Electronics Ltd.
|
| 90130-1226 0901301226 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1254 0901301254 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1238 0901301238 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 90130-1234 0901301234 |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
|
